Vital Materials has released a new white paper, Breaking the InP Bottleneck: A Vertically Integrated InP Supply Strategy for AI Data-Center Optics, examining the growing supply chain challenges facing the optical communications industry as AI infrastructure advances toward 1.6T and 3.2T connectivity.

The paper explores how increasing demand for indium phosphide (InP) substrates, epitaxial wafers, and laser devices is placing pressure on qualified manufacturing capacity, creating potential constraints for next-generation optical transceivers.

It also highlights Vital’s vertically integrated Source to Solutions strategy, connecting raw indium, InP substrates, epitaxy, laser fabrication, and optical transceivers within a coordinated supply chain. This approach is designed to improve supply assurance, manufacturing efficiency, and scalability for hyperscale data center applications.

Download the full white paper to explore the challenges shaping the InP supply chain and the role of vertical integration in supporting next-generation optical connectivity.